Dr Tai-chin Lo Nanosystem
Fabrication Facility (CWB)
wet : Gold electro-plating
wet : Post CMP Wafer Cleaning
wet : PR strip on Al film
wet : Anisotopic silicon etch using KOH
wet : Ni Etching
wet : Strain Etch for SEM and cross-section microscope
wet : Pad wet etch
wet : Gold wet etching
wet : Cu Etching
wet : ITO wet etching
wet : Gold electro-etching
wet : Anisotopic silicon etch using TMAH
wet : silicon nitride wet etch
wet : Oxide wet etch
wet : Si wafer cleaning
wet : TiW wet etching
wet : One side KOH or TMAH etching
wet : Al/2%Si metal film wet etch
wet : Wet etching of Ge
spu : Gold film deposition using CVC sputtering
spu : TiW film deposition using CVC sputtering
spu : Al film deposition using CVC sputtering
pho : Cr mask duplication
pho : Cr mask making process
pho : AZ 4620
pho : AZ 1518
pho : Photosensitive polyimide
pho : Fe oxide mask duplication
pho : Polyimide dielectric
pho : SPR 660_1
pho : AZ 7908
pho : AZ 5200NJ
pho : FH 6400L
pho : High resolution patterning using half way develop
pho : AZ HIR 1075
pho : AZ 5214E
pho : AZ 5206E
pho : AZ 703
pho : P4903 Thick film photoresist for bump
pho : Double-side IR alignment
pho : Lift-off Metallization for 4.5 um trench patterns
pho : Thick film photoresist for bump 2 (AZ PLP 100)
pho : 0.2 um isolated lines patterning using double expose
pho : HPR 504
pho : EVG Spray Coating
pho : Coating for deep trench
pho : HPR 506
pho : LOL 2000
memc : Anodic bonding
memc : Gold-Silicon bonding